Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6482289 | Nonconductive laminate for coupling substrates and method therefor | Melissa Grupen-Shemansky, Shun-Meen Kuo | 2002-11-19 |
| 6458622 | Stress compensation composition and semiconductor component formed using the stress compensation composition | Lizabeth Keser | 2002-10-01 |
| 6451127 | Conductive paste and semiconductor component having conductive bumps made from the conductive paste | Li Li | 2002-09-17 |