Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6479760 | Printed wiring board for semiconductor plastic package | Hidenori Kimbara, Katsuji Komatsu | 2002-11-12 |
| 6396143 | Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board | Hidenori Kimbara, Katsuji Komatsu | 2002-05-28 |
| 6376908 | Semiconductor plastic package and process for the production thereof | Morio Gaku, Nobuyuki Yamane | 2002-04-23 |
| 6362436 | Printed wiring board for semiconductor plastic package | Hidenori Kimbara, Katsuji Komatsu | 2002-03-26 |
| 6350952 | Semiconductor package including heat diffusion portion | Morio Gaku, Toshihiko Kobayashi | 2002-02-26 |
| 6337463 | Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole | Morio Gaku, Yasuo Tanaka, Yoshihiro Kato | 2002-01-08 |