Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376908 | Semiconductor plastic package and process for the production thereof | Nobuyuki Ikeguchi, Nobuyuki Yamane | 2002-04-23 |
| 6350952 | Semiconductor package including heat diffusion portion | Nobuyuki Ikeguchi, Toshihiko Kobayashi | 2002-02-26 |
| 6337463 | Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole | Nobuyuki Ikeguchi, Yasuo Tanaka, Yoshihiro Kato | 2002-01-08 |