Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6479443 | Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film | Liming Zhang, Yuexing Zhao, Wilbur C. Krusell | 2002-11-12 |
| 6423200 | Copper interconnect seed layer treatment methods and apparatuses for treating the same | — | 2002-07-23 |
| 6358847 | Method for enabling conventional wire bonding to copper-based bond pad features | Hugh Li | 2002-03-19 |