Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6442043 | Chip assembly module of bump connection type using a multi-layer printed circuit substrate | Masahiro Kaizu | 2002-08-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6442043 | Chip assembly module of bump connection type using a multi-layer printed circuit substrate | Masahiro Kaizu | 2002-08-27 |