Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6442043 | Chip assembly module of bump connection type using a multi-layer printed circuit substrate | Yoshihito Seki | 2002-08-27 |
| 6387734 | Semiconductor package, semiconductor device, electronic device and production method for semiconductor package | Masatoshi Inaba, Takanao Suzuki, Tadanori Ominato, Akihito Kurosaka | 2002-05-14 |