Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6437984 | Thermally enhanced chip scale package | Anthony M. Chiu | 2002-08-20 |
| 6372543 | Wrap-around interconnect for fine pitch ball grid array | Anthony M. Chiu, Harry Michael Siegel, Michael J. Hundt | 2002-04-16 |