Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6437984 | Thermally enhanced chip scale package | Tom Lao | 2002-08-20 |
| 6414849 | Low stress and low profile cavity down flip chip and wire bond BGA package | — | 2002-07-02 |
| 6410985 | Silver metallization by damascene method | Tsiu C. Chan, Gregory C. Smith | 2002-06-25 |
| 6372543 | Wrap-around interconnect for fine pitch ball grid array | Tom Lao, Harry Michael Siegel, Michael J. Hundt | 2002-04-16 |