RK

Ronald Kakoschke

SA Siemens Aktiengesellschaft: 2 patents #81 of 1,154Top 8%
Infineon Technologies Ag: 1 patents #207 of 647Top 35%
Overall (2002): #21,967 of 266,432Top 9%
3
Patents 2002

Issued Patents 2002

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6440827 Method for fabricating a semiconductor component having a wiring which runs piecewise in the substrate, and also a semiconductor component which can be fabricated by this method Helga Braun, Regina Stokan, Andreas Kux, Gunther Plasa 2002-08-27
6429520 Semiconductor component with silicon wiring and method of fabricating the component Regina Stokan 2002-08-06
6376875 Semiconductor component with compensation implantation Holger Sedlak 2002-04-23