Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6348731 | Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same | Hormazdyar M. Dalal, Du Nguyen, Hazara S. Rathore, Richard G. Smith | 2002-02-19 |