Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6348731 | Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same | Leon Ashley, Du Nguyen, Hazara S. Rathore, Richard G. Smith | 2002-02-19 |
| 6344234 | Method for forming reflowed solder ball with low melting point metal cap | Alexis Bitaillou, Kenneth Michael Fallon, Gene J. Gaudenzi, Kenneth Robert Herman, Frederic Pierre +1 more | 2002-02-05 |
| 6336262 | Process of forming a capacitor with multi-level interconnection technology | Gene J. Gaudenzi, Rebecca Y. Gorrell, Mark A. Takacs, Kenneth J. Travis, Jr. | 2002-01-08 |