Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6391669 | Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices | Benjamin V. Fasano, Hai P. Longworth, Vincent P. Peterson, Robert N. Wiggin | 2002-05-21 |