Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6445076 | Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same | Takehiro Shimizu, Takafumi Dohdoh, Kazumi Tameshige, Hidekazu Matsuura, Yoshihiro Nomura +3 more | 2002-09-03 |
| 6335227 | Method of fabricating a lead-on-chip (LOC) semiconductor device | Kunihiro Tsubosaki, Masachika Masuda, Akihiko Iwaya, Atsushi Nakamura, Chikako Imura | 2002-01-01 |