Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6445076 | Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same | Takehiro Shimizu, Takafumi Dohdoh, Kazumi Tameshige, Yoshihiro Nomura, Kunihiro Tsubosaki +3 more | 2002-09-03 |
| 6372080 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | Yoshihide Iwazaki, Naoto Ohta | 2002-04-16 |