Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6372080 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | Hidekazu Matsuura, Naoto Ohta | 2002-04-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6372080 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | Hidekazu Matsuura, Naoto Ohta | 2002-04-16 |