SO

Shingo Ohsaka

HS Hitachi Hokkai Semiconductor: 3 patents #2 of 23Top 9%
HI Hitachi: 1 patents #1,533 of 3,950Top 40%
📍 Hakodate, JP: #1 of 2 inventorsTop 50%
Overall (2002): #20,998 of 266,432Top 8%
3
Patents 2002

Issued Patents 2002

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6476466 Ball grid array type semiconductor package having a flexible substrate Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani 2002-11-05
6448111 Method of manufacturing a semiconductor device Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani 2002-09-10
6437428 Ball grid array type semiconductor package having a flexible substrate Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani 2002-08-20