Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6476466 | Ball grid array type semiconductor package having a flexible substrate | Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2002-11-05 |
| 6448111 | Method of manufacturing a semiconductor device | Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2002-09-10 |
| 6437428 | Ball grid array type semiconductor package having a flexible substrate | Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani | 2002-08-20 |