Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6428719 | Etching process to selectively remove copper plating seed layer | Xuehua Wu, Si-Tuan Lam, Henry Chang, Kochan Ju, Jei-Wei Chang | 2002-08-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6428719 | Etching process to selectively remove copper plating seed layer | Xuehua Wu, Si-Tuan Lam, Henry Chang, Kochan Ju, Jei-Wei Chang | 2002-08-06 |