Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6428719 | Etching process to selectively remove copper plating seed layer | Wensen Li, Si-Tuan Lam, Henry Chang, Kochan Ju, Jei-Wei Chang | 2002-08-06 |
| 6395458 | Corrosion inhibitor of NiCu for high performance writers | Yi-Chun Liu, Jei-Wei Chang, Kochan Ju | 2002-05-28 |
| 6387599 | Corrosion inhibitor of NiCu for high performance writers | Yi-Chun Liu, Jei-Wei Chang, Kochan Ju | 2002-05-14 |