Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6396153 | Circuit chip package and fabrication method | Raymond Albert Fillion, Ernest Wayne Balch, Ronald Frank Kolc, William Edward Burdick, Jr., Robert J. Wojnarowski +1 more | 2002-05-28 |
| 6368410 | Semiconductor processing article | Udo Heinz Retzlaff, Stephan Popp | 2002-04-09 |