Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492263 | Dual damascene process which prevents diffusion of metals and improves trench-to-via alignment | Hsin-Tang Peng, Fu-Cheng Lin | 2002-12-10 |
| 6410417 | Method of forming tungsten interconnect and vias without tungsten loss during wet stripping of photoresist polymer | Nien-Yu Tsai, Hong-Long Chang, Ming-Li Kung | 2002-06-25 |