Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6372113 | Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same | Charles B. Yates, George Gaskill, Chinsai T. Cheng, Ajesh Shah, Adam M. Wolski | 2002-04-16 |