Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6372113 | Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same | Charles B. Yates, Chinsai T. Cheng, Ajesh Shah, Adam M. Wolski, Paul E. DuFresne | 2002-04-16 |
| 6342308 | Copper foil bonding treatment with improved bond strength and resistance to undercutting | Charles B. Yates, Chinsai T. Cheng, Ajesh Shah | 2002-01-29 |