Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492252 | Method of connecting a bumped conductive trace to a semiconductor chip | Charles W. C. Lin | 2002-12-10 |
| 6486549 | Semiconductor module with encapsulant base | — | 2002-11-26 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492252 | Method of connecting a bumped conductive trace to a semiconductor chip | Charles W. C. Lin | 2002-12-10 |
| 6486549 | Semiconductor module with encapsulant base | — | 2002-11-26 |