Issued Patents 2002
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492252 | Method of connecting a bumped conductive trace to a semiconductor chip | Cheng-Lien Chiang | 2002-12-10 |
| 6451626 | Three-dimensional stacked semiconductor package | — | 2002-09-17 |
| 6448108 | Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment | — | 2002-09-10 |
| 6444489 | Semiconductor chip assembly with bumped molded substrate | — | 2002-09-03 |
| 6440835 | Method of connecting a conductive trace to a semiconductor chip | — | 2002-08-27 |
| 6436734 | Method of making a support circuit for a semiconductor chip assembly | — | 2002-08-20 |
| 6420225 | Method of fabricating power rectifier device | Paul Chang, Vladimir Rodov, Geeng-Chuan Chern, Ching-Lang Chiang | 2002-07-16 |
| 6403460 | Method of making a semiconductor chip assembly | — | 2002-06-11 |
| 6402970 | Method of making a support circuit for a semiconductor chip assembly | — | 2002-06-11 |
| 6350386 | Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly | — | 2002-02-26 |
| 6350633 | Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint | — | 2002-02-26 |
| 6350632 | Semiconductor chip assembly with ball bond connection joint | — | 2002-02-26 |