Issued Patents 2002
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495393 | Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts | Colin Hatchard, Ian Morgan | 2002-12-17 |
| 6483337 | Method for achieving synchronous non-destructive latchup characterization | Scott E. Johnson | 2002-11-19 |
| 6461879 | Method and apparatus for measuring effects of packaging stresses of common IC electrical performance parameters at wafer sort | Richard C. Sidharth | 2002-10-08 |
| 6429657 | Apparatus for improving image depth resolution in a magnetic field imaging apparatus | — | 2002-08-06 |
| 6395568 | Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit products | Colin Hatchard, Ian Morgan, Michael Fliesler | 2002-05-28 |
| 6373126 | Method for reducing IC package delamination by use of internal baffles | Pramod D. Patel | 2002-04-16 |
| 6362524 | Edge seal ring for copper damascene process and method for fabrication thereof | Kurt Taylor, David C. Greenlaw | 2002-03-26 |
| 6348356 | Method and apparatus for determining the robustness of memory cells to alpha-particle/cosmic ray induced soft errors | Sunil N. Shabde, Donald L. Wollesen | 2002-02-19 |
| 6339728 | Method for marking semiconductor device using a green laser | Quang D. Nguyen | 2002-01-15 |