Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495393 | Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts | Richard C. Blish, II, Colin Hatchard | 2002-12-17 |
| 6395568 | Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit products | Richard C. Blish, II, Colin Hatchard, Michael Fliesler | 2002-05-28 |