Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436735 | Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact | Martin Goetz, Sammy K. Brown, George E. Avery, Andrew K. Wiggin, Tom L. Todd | 2002-08-20 |