Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436735 | Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact | Martin Goetz, Sammy K. Brown, George E. Avery, Tom L. Todd, Sam Beal | 2002-08-20 |
| 6400575 | Integrated circuits packaging system and method | Sammy K. Brown, George E. Avery, Samuel W. Beal | 2002-06-04 |
| 6337576 | Wafer-level burn-in | Allan Calamoneri, Martin Goetz, John J. Zasio, George E. Avery, Sammy K. Brown | 2002-01-08 |