Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489682 | Ball grid array semiconductor package and substrate therefor | Shu Jung Ma, Shiun Jaw Hsien | 2002-12-03 |
| 6423622 | Lead-bond type chip package and manufacturing method thereof | Kun-Ching Chen | 2002-07-23 |