Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6455941 | Chip scale package | Xin Lee, Yi Ding | 2002-09-24 |
| 6423622 | Lead-bond type chip package and manufacturing method thereof | Yung-I Yeh | 2002-07-23 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6455941 | Chip scale package | Xin Lee, Yi Ding | 2002-09-24 |
| 6423622 | Lead-bond type chip package and manufacturing method thereof | Yung-I Yeh | 2002-07-23 |