ML

Meng-Hui Lin

AE Advanced Semiconductor Engineering: 1 patents #23 of 62Top 40%
📍 New Taipei, TW: #93 of 273 inventorsTop 35%
Overall (2002): #155,765 of 266,432Top 60%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6387728 Method for fabricating a stacked chip package Tsung-Ming Pai, Chung-Hao Lee, Pao-Hei Chang Chin, Song Wang 2002-05-14