Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6387728 | Method for fabricating a stacked chip package | Tsung-Ming Pai, Pao-Hei Chang Chin, Meng-Hui Lin, Song Wang | 2002-05-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6387728 | Method for fabricating a stacked chip package | Tsung-Ming Pai, Pao-Hei Chang Chin, Meng-Hui Lin, Song Wang | 2002-05-14 |