Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5665249 | Micro-electromechanical die module with planarized thick film layer | Cathie J. Burke, William G. Hawkins, Herman A. Hermanson, Almon P. Fisher, Diane Atkinson | 1997-09-09 |