KE

Karl Egglhuber

WA Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag: 1 patents #1 of 9Top 15%
📍 Hebertsfelden, DE: #1 of 1 inventorsTop 100%
Overall (1997): #123,615 of 185,788Top 70%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5616065 Wire saw and method for cutting wafers from a workpiece — 1997-04-01