Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5691247 | Method for depositing a flow fill layer on an integrated circuit wafer | Zmira Lavie, Jeff Levy, Itzhak Edrei | 1997-11-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5691247 | Method for depositing a flow fill layer on an integrated circuit wafer | Zmira Lavie, Jeff Levy, Itzhak Edrei | 1997-11-25 |