Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5603879 | Method of molding resin to seal electronic parts using two evacuation steps | Michio Osada, Makoto Matsuo, Koichi Araki | 1997-02-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5603879 | Method of molding resin to seal electronic parts using two evacuation steps | Michio Osada, Makoto Matsuo, Koichi Araki | 1997-02-18 |