Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5641839 | Novolac type epoxy resin and electronic parts encapsulating resin composition | Seigo Takuwa, Hideyasu Asakage | 1997-06-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5641839 | Novolac type epoxy resin and electronic parts encapsulating resin composition | Seigo Takuwa, Hideyasu Asakage | 1997-06-24 |