Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5674773 | Method for planarizing high step-height integrated circuit structures | Chao-Ming Koh | 1997-10-07 |
| 5631112 | Multiple exposure method for photo-exposing photosensitive layers upon high step height topography substrate layers | Ming-Horn Tsai, Shih-Yin Lan | 1997-05-20 |