Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702981 | Method for forming a via in a semiconductor device | Papu D. Maniar, Jeffrey L. Klein, Wei-Jen Wu | 1997-12-30 |
| 5633199 | Process for fabricating a metallized interconnect structure in a semiconductor device | Robert W. Fiordalice | 1997-05-27 |