Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5605489 | Method of protecting micromechanical devices during wafer separation | Richard O. Gale | 1997-02-25 |
| 5597767 | Separation of wafer into die with wafer-level processing | Laurinda Ng, Ronald S. Croff, Robert G. McKenna, Lawrence D. Dyer | 1997-01-28 |