Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5650915 | Thermally enhanced molded cavity package having a parallel lid | Rafael C. Alfaro, Paul J. Hundt | 1997-07-22 |
| 5648299 | Packaged semiconductor device and a leadframe therefor | Ichiro Anjoh, Gen Murakami, Michael A. Lamson | 1997-07-15 |