Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5613296 | Method for concurrent formation of contact and via holes | Yasuhiro Ogata | 1997-03-25 |
| 5610100 | Method for concurrently forming holes for interconnection between different conductive layers and a substrate element or circuit element close to the substrate surface | Yoichi Miyai | 1997-03-11 |