Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5683289 | CMP polishing pad conditioning apparatus | — | 1997-11-04 |
| 5609719 | Method for performing chemical mechanical polish (CMP) of a wafer | — | 1997-03-11 |
| 5597346 | Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process | — | 1997-01-28 |
| 5597443 | Method and system for chemical mechanical polishing of semiconductor wafer | — | 1997-01-28 |