Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5671125 | Vertical package mounted on both sides of a printed circuit board | Daniel Baudouin, James Wallace | 1997-09-23 |
| 5637828 | High density semiconductor package | Daniel Baudouin, Duy-Loan T. Le, James Wallace | 1997-06-10 |
| 5600178 | Semiconductor package having interdigitated leads | — | 1997-02-04 |