Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5628892 | Electroplating method and apparatus for the preparation of metal foil and split insoluble electrode used therein | Kazuhide Ohe, Hiroyuki Nakada | 1997-05-13 |
| 5625214 | Semiconductor device | Yoshitaka Kinoshita, Hideaki Nakamura | 1997-04-29 |