WW

Wen-Teng Wu

TSMC: 1 patents #44 of 161Top 30%
📍 Baoshan, TW: #36 of 149 inventorsTop 25%
Overall (1997): #60,998 of 185,788Top 35%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5700735 Method of forming bond pad structure for the via plug process Ruey-Yun Shiue, Pi-Chen Shieh, Chin-Kai Liu 1997-12-23