Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5643834 | Process for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layers | Keizo Harada, Takao Maeda, Shunsuke Ban, Shosaku Yamanaka | 1997-07-01 |