Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5686353 | Semiconductor device and manufacturing method thereof | Yoshihiko Yagi, Kazushi Higashi, Norihito Tsukahara, Koichi Kumagai | 1997-11-11 |
| 5667130 | Ultrasonic wire bonding apparatus and method | Makoto Morita, Masaru Nagaike, Richard Gueler, Makoto Imanishi | 1997-09-16 |