Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5646204 | Epoxy resin composition and resin-encapsulated semiconductor device | Masatsugu Akiba, Kazuo Takebe, Noriaki Saito, Takashi Morimoto | 1997-07-08 |
| 5644003 | Epoxy resin composition, process for producing the same and resin-sealed semiconductor device | Noriyuki Arai, Hiroshi Nakamura, Noriaki Saito | 1997-07-01 |